Rapid-Setting, Polymer-Modified, Self-Leveling Underlayment
Polyplan RSL is a fast-setting, two-part, self-leveling and smoothing compound with enhanced bond over nonporous substrates including MAPEI epoxy moisture barriers and razor-scraped adhesive residues. Polyplan RSL can be placed directly over burnished, dense concrete substrates that are free of sealers, curing compounds and form-release compounds.